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Gallium nitride (GaN)-based high electron mobility transistors (HEMTs) are essential components in modern radio frequency power amplifiers. In order to improve both the device electrical and thermal performance (e.g., higher current density operation and better heat dissipation), researchers are introducing AlN into the GaN HEMT structure. The knowledge of thermal properties of the constituent layers, substrates, and interfaces is crucial for designing and optimizing GaN HEMTs that incorporate AlN into the device structure as the barrier layer, buffer layer, and/or the substrate material. This study employs a multi-frequency/spot-size time-domain thermoreflectance approach to measure the anisotropic thermal conductivity of (i) AlN and GaN epitaxial films, (ii) AlN and SiC substrates, and (iii) the thermal boundary conductance for GaN/AlN, AlN/SiC, and GaN/SiC interfaces (as a function of temperature) by characterizing GaN-on-SiC, GaN-on-AlN, and AlN-on-SiC epitaxial wafers. The thermal conductivity of both AlN and GaN films exhibits an anisotropy ratio of ∼1.3, where the in-plane thermal conductivity of a ∼1.35 μm thick high quality GaN layer (∼223 W m−1 K−1) is comparable to that of bulk GaN. A ∼1 μm thick AlN film grown by metalorganic chemical vapor deposition possesses a higher thermal conductivity than a thicker (∼1.4 μm) GaN film. The thermal boundary conductance values for a GaN/AlN interface (∼490 MW m-2 K−1) and AlN/SiC interface (∼470 MW m−2 K−1) are found to be higher than that of a GaN/SiC interface (∼305 MW m−2 K−1). This work provides thermophysical property data that are essential for optimizing the thermal design of AlN-incorporated GaN HEMT devices. 

Early detection of dental disease is crucial to prevent adverse outcomes. Today, dental X-rays are currently the most accurate gold standard for dental disease detection. Unfortunately, regular X-ray exam is still a privilege for billions of people around the world. In this paper, we ask: Can we develop a low-cost sensing system that enables dental self-examination in the comfort of one's home? This paper presents ToMoBrush, a dental health sensing system that explores using off-the-shelf sonic toothbrushes for dental condition detection. Our solution leverages the fact that a sonic toothbrush produces rich acoustic signals when in contact with teeth, which contain important information about each tooth's status. ToMoBrush extracts tooth resonance signatures from the acoustic signals to characterize the dental condition of each tooth. We further develop a data-driven signal processing pipeline to detect and discriminate different dental conditions. We evaluate ToMoBrush on 19 participants and dental-standard models for detecting common dental problems including caries, calculus, and food impaction, achieving a detection ROC-AUC of 0.90, 0.83, and 0.88 respectively. Interviews with dental experts further validate ToMoBrush's potential in enhancing at-home dental healthcare. 

Lead zirconate titanate (PZT) thin films offer advantages in microelectromechanical systems (MEMSs) including large motion, lower drive voltage, and high energy densities. Depending on the application, different substrates are sometimes required. Self-heating occurs in the PZT MEMS due to the energy loss from domain wall motion, which can degrade the device performance and reliability. In this work, the self-heating of PZT thin films on Si and glass and a film released from a substrate were investigated to understand the effect of substrates on the device temperature rise. Nano-particle assisted Raman thermometry was employed to quantify the operational temperature rise of these PZT actuators. The results were validated using a finite element thermal model, where the volumetric heat generation was experimentally determined from the hysteresis loss. While the volumetric heat generation of the PZT films on different substrates was similar, the PZT films on the Si substrate showed a minimal temperature rise due to the effective heat dissipation through the high thermal conductivity substrate. The temperature rise on the released structure is 6.8× higher than that on the glass substrates due to the absence of vertical heat dissipation. The experimental and modeling results show that the thin layer of residual Si remaining after etching plays a crucial role in mitigating the effect of device self-heating. The outcomes of this study suggest that high thermal conductivity passive elastic layers can be used as an effective thermal management solution for PZT-based MEMS actuators. 

The ultra-wide bandgap (UWBG) energy (∼5.4 eV) of α-phase Ga2O3 offers the potential to achieve higher power switching performance and efficiency than today's power electronic devices. However, a major challenge to the development of the α-Ga2O3 power electronics is overheating, which can degrade the device performance and cause reliability issues. In this study, thermal characterization of an α-Ga2O3 MOSFET was performed using micro-Raman thermometry to understand the device self-heating behavior. The α-Ga2O3 MOSFET exhibits a channel temperature rise that is more than two times higher than that of a GaN high electron mobility transistor (HEMT). This is mainly because of the low thermal conductivity of α-Ga2O3 (11.9 ± 1.0 W/mK at room temperature), which was determined via laser-based pump-probe experiments. A hypothetical device structure was constructed via simulation that transfer-bonds the α-Ga2O3 epitaxial structure over a high thermal conductivity substrate. Modeling results suggest that the device thermal resistance can be reduced to a level comparable to or even better than those of today's GaN HEMTs using this strategy combined with thinning of the α-Ga2O3 buffer layer. The outcomes of this work suggest that device-level thermal management is essential to the successful deployment of UWBG α-Ga2O3 devices.